Advanced Signal and Power Integrity
Be the first to know about future course dates - click the 'Notify me' button on the right of this page.
This course will provide participants with the knowledge to break down the link path for analysis and design.
It also covers fundamental jitter concepts, as well as developing parasitic models for non-ideal geometries in the link path.
We explore a systematic approach to PDN design including target impedance and its limitations, reconciling TD/FD concepts for PDN design, the effect of stackup and decoupling capacitors, and modeling the PDN for multi-layer boards.
The course will be taught by two of the world’s leading signal and power integrity specialists, Dr Bruce Archambeault, Distinguished Lecturer for the IEEE EMC Society and Dr Jim Drewniak, Department of Electrical and Computer Engineering, Missouri University of Science and Technology.
This course is part of Oxford University's High-Speed Digital, Analogue and EMC Engineering Month.
Link Path Analysis I: System-Level Concepts & Physics
- Causal & passive systems, evaluation & enforcement
- Block-by-block analysis & breaking down the link path geometry - TEM/non-TEM
- Modeling & cascading blocks
- S-parameter review & mixed-mode S-parameters for differential signals - physical description
- Ideal RL, IL, and transmission phase, quantifying deviations on eye-pattern
Tools: FEMAS Link path analyzer
Link-Path Analysis II: Discontinuities and Non-Ideal Effects
- Physics-based modeling concepts for discontinuities
- Developing parasitic models - identifying Ls &Cs and constructing the circuit topology
- Via transitions
Tools: FEMAS Link path analyzer, FEMAS MVTT - Via too
- Differential signals
- Practical field physics, waveforms and skew
- Mixed-mode S-parameters for differential busses - physics and concepts
- Differential cross-talk
- Mode conversion
Tools: FEMAS cross-sectional analysis tool, FEMAS Link path analyzer
SI Design Examples
- DDR3 link
- 10G Ethernet link
Jitter I: Jitter Fundamentals
- Eye diagrams, jitter, bathtub curves and BER – an overview
- Identifying jitter components & examples
- Time interval error
Tools: FEMAS Link path analyzer
Jitter II: Jitter Models and Jitter Through the Link-Path
Models for jitter components
Effect of non-ideal link path (linear filters) on jitter components - ISI
Tools: FEMAS Link path analyzer
PDN I: Impedance Concepts, Inductance
- A modified target impedance approach
- Inductance in PDN design, consequences - PCB & packaging
- A systematic approach for PDN design
Tools: FEMAS multi-layer PDN tool, FEMAS inductance extractor
PDN II: Impedance Concepts, Inductance
- PDN in the TD and FD - matching the responses
- Time-domain voltage ripple from PDN design
- Quantifying layer stackup, capacitor location, and total capacitance
Tools: Multi-layer PDN tool
Participants who attend the full course will receive a University of Oxford Certificate of Attendance. The sample shown is an illustration only and the wording will reflect the course and dates attended.
Accommodation is available at the Rewley House Residential Centre, within the Department for Continuing Education, in central Oxford. The comfortable, en-suite, study-bedrooms have been rated as 4-Star Campus accommodation under the Quality In Tourism scheme, and come with tea- and coffee-making facilities, free Wi-Fi access and Freeview TV. Guests can take advantage of the excellent dining facilities and common room bar, where they may relax and network with others on the programme.
Course fee, standard: £1395.00
Discount package fee (add Intermediate course): £2195.00
The standard course fee for the Advanced Signal and Power Integrity course is £1395.00
Discount package fee for both the Advanced Signal and Power Integrity course and Intermediate Signal and Power Integrity course is £2195.00 (savings of £195)
Pay immediately online by credit or debit card
Click the “book now” button on this webpage to pay online with a credit or debit card
Pay with your preferred payment method
Send a completed application form to the course administrator by e-mail or post, and choose:
- BACS payment
- Cheque payment
- Credit or debit card payment. Please do not send card details via email
Fees include course materials, tuition, refreshments and lunches. The price does not include accommodation.
All courses are VAT exempt.
Dr Bruce Archambeault
Archambeault EMI Enterprises, USA
Dr. Bruce Archambeault received his B.S.E.E degree from the University of New Hampshire in 1977 and his M.S.E.E degree from Northeastern University in 1981. He received his Ph. D. from the University of New Hampshire in 1997. His doctoral research was in the area of computational electromagnetics applied to real-world EMC problems.
In 1981 he joined Digital Equipment Corporation and through 1994 he had assignments ranging from EMC/TEMPEST product design and testing to developing computational electromagnetic EMC-related software tools. In 1994 he joined SETH Corporation where he continued to develop computational electromagnetic EMC-related software tools and used them as a consulting engineer in a variety of different industries.
He recently retired from IBM in Raleigh, N.C. where he was a Senior member of Technical Staff, and a lead EMC engineer, responsible for EMC tool development and use on a variety of products. During his career in the U.S. Air Force he was responsible for in-house communications security and TEMPEST/EMC related research and development projects.
Dr. Archambeault has authored or co-authored a number of papers in computational electromagnetics, mostly applied to real-world EMC applications. He is currently a member of the Board of Directors on the IEEE EMC Society and a member of the Board of Directors of the Applied Computational Electromagnetics Society (ACES).
He is the author of the book titled PCB Design for Real-World EMI Control and the lead author of the book titled EMI/EMC Computational Modeling Handbook. Dr. Archambeault is currently a Distinguished Lecturer for the IEEE EMC Society and a Master EMC Design Engineer, certified by iNARTE (International Association for Radio, Telecommunications and Electromagnetics).
Dr James L Drewniak
Department of Electrical and Computer Engineering, Missouri University of Science and Technology (formerly the University of Missouri-Rolla)
James L. Drewniak received B.S., M.S., and Ph.D. degrees in electrical engineering from the University of Illinois at Urbana-Champaign. He is with Electromagnetic Compatibility Laboratory in the Electrical Engineering Department at Missouri University of Science and Technology. His research and teaching interests include electromagnetic compatibility in high-speed digital and mixed-signal designs, signal and power integrity, electronic packaging, electromagnetic compatibility in power electronic based systems, electronics, and antenna design.
He is one of the leaders of a university research laboratory that is internationally recognized as a leader in EMC and signal and power integrity, with approximately 60 people, including 5 tenured faculty, 4 research professors, and over 35 graduate students. The funding for the laboratory is a balance of US government sponsors including the NSF, DoD agencies, and DOE, and industry, and a state-of-the-art $10M laboratory facility. A key funding component of the research is a US National Science Foundation Industry/University Research Center (I/UCRC) that is a consortium of approximately 20 companies, with over 20 funded projects.
He is a Fellow of the IEEE, and a current Distinguished Lecturer for the IEEE EMC Society. He has published 85 journal papers and over 225 conference papers.
If you would like to discuss your application or any part of the application process before applying, please contact:
Tel: +44 (0)1865 286958
Level and demands
Participants will have familiarity with fundamental SI and PI concepts of signals, signal propagation on basic transmission lines, cross-talk, multi-conductor signal buses, and PDN function that comprise the previous two-day Level 1 course.
If you're uncertain whether this course is suitable for your requirements, please email us with any questions you may have.
Terms and conditions
Terms and conditions for applicants and students on this course
Sources of funding
Information on financial support