Mechanical Design for EMC
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This two-day course for mechanical engineers on 11 and 14 June 2019 provides clear applications, theory and demonstrations for the successful design of mechanical enclosures for good system emissions and immunity performance. Key topics include grounding at the PCB and enclosure, system ground maps, PCB component placement and control drawings, enclosure and cable shielding, PCB device “cans”, resonant slots and enclosures, heat sinks, unintentional antennas, as well as connector, screw, and conductive gasket placement.
This two-day course is Day 1 and Day 4 of a four-day programme from 11 – 14 June 2019:
- Day 1: Introduction (11 June)
- Optional Day 2: Applying Practical EMI Design and Troubleshooting Techniques (12 June)
- Optional Day 3: Advanced Printed Circuit Board Design for EMI & Signal Integrity (13 June)
- Day 4: Mechanical Design for EMC (14 June)
At checkout, you may choose to add either or both of Day 2 and Day 3 to your enrolment.
11 June 2019 - Introduction
Section 1: Measuring and inducing noise
- Electromagnetic Compatibility
- Radiated emissions & associated measurements + DEMONSTRATION
- High level overview of impact of EMC requirements on system design and performance
- Case histories of US, international, and SILENT EMC problems and their impact
- Uncertainty in measurements. Underlying problems in predicting results
- Conducted emissions—mode separation, LISNs, troubleshooting
- Function and purpose of immunity tests with simplified schematics
Section 2: Predictiong and solving noise problems
- Capacitance—in ESD, PD boards, decoupling networks, filter networks, cables + DEMONSTRATION
- Inductance—in PC boards, connectors, ICs, high speed signal paths, decoupling networks, filter networks
- Behavior of current paths at low and high frequencies + DEMONSTRATION
- Develop a customized source/victim/coupling-factor list of your company’s designs
14 June 2019
Section 1: Review of key concepts and introduction to shielding
- The theoretical, perfectly shielded enclosure
- The expensive, practical enclosure
- Review of the four noise paths
- Understanding & visualizing common-mode current + DEMONSTRATION
- Accidental antennas and antenna circuits
- Regulatory and functional emissions and immunity tests
- The three properties of electromagnetic shields
Section 2: PCB and mechanical control drawings
- Placement and location of grounds, and connectors
- Effects of heat sinks
- “Ground” / reference maps
- External shielded connector interfaces
Sections 3: Shielding
- Why EMC shielding math in textbooks is wrong
- Classical shielding and shielding for EMC
- Problems with the prediction of shielding effectiveness
- Practical aspects of shielding enclosures
- Slot and cavity resonances in shielded enclosures + DEMONSTRATION
- Review: The three properties of electromagnetic shields
- Reflective and absorptive properties of shields + low frequency shielding
- Magnetically conductive materials
- Transfer impedance for base materials, connectors, cables and enclosures
- Test your knowledge by reviewing a proposed design
- Effects of apertures
- Latest research on apertures and cavities
- Simple tests to verify performance of enclosures and transfer impedance + DEMONSTRATION
- Overall shielding using enclosures
- PCB level shields + factors that affect performance
- Prevention of “accidental antennas”
- Troubleshooting techniques
Section 4: Shielding of cables
- Cable shielding and terminations
- Applying transfer impedance concepts to cables, connectors, and system interconnect
- Examples and discussions of common shielded connectors and their defects (ENET, d-sub, video)
- Shield terminations + DEMONSTRATION
- What to ground, where, and why
- Examples of bad cable shielding designs
Test and measurement equipment for this course is supplied by Rohde & Schwarz
Participants who attend the full course will receive a University of Oxford Certificate of Attendance. The sample shown is an illustration only and the wording will reflect the course and dates attended.
Although not included in the course fee, accommodation may be available at our on-site Rewley House Residential Centre. All bedrooms are en suite and decorated to a high standard, and come with tea- and coffee-making facilities, free Wi-Fi access and Freeview TV. Guests can take advantage of the excellent dining facilities and common room bar, where they may relax and network with others on the programme.
To check prices, availability and to book rooms please visit the Rewley House Residential Centre website.
11 and 14 June - Days 1 and 4 (standard course fee): £895.00
12 June - Day 2 - Applying Practical EMI Design (optional): £447.50
13 June - Day 3 - Advanced PCB Design (optional): £447.50
Fees include course materials, tuition, refreshments and lunches. The price does not include accommodation.
All courses are VAT exempt.
Register immediately online
Click the “book now” button on this webpage. Payment by credit or debit card is required.
Request an invoice
Send a completed application form to the course administrator by email or post. Please do not send card details via email.
SILENT Solutions LLC & GmbH, USA & Germany
Lee Hill is Founding Partner of SILENT Solutions, an electromagnetic compatibility (EMC) consulting firm he started in Silicon Valley in 1992. He is also Managing Director of Silent Solutions GmbH (Munich).
He received his MSEE with highest honors from the Missouri University of Science & Technology EMC Laboratory emclab.mst.edu, where he studied under Dr.’s Thomas Van Doren, Todd Hubing, and James Drewniak.
Lee teaches a graduate course in EMC as a member of adjunct faculty at Worcester Polytechnic Institute (WPI), and is also an EMC course instructor for University of Oxford (England), and for the IEEE EMC Society's annual Global University and Fundamentals Program. Lee is the named inventor of three US patents for EMI control in electronic systems, and provides expert witness services for patent litigation. While teaching is one of Lee’s favorite jobs at SILENT, the majority of his time is spent providing hands-on hardware troubleshooting of / and design reviews to prevent elusive regulatory and functional electrical noise problems.
Lee is a past EMC course instructor for the University of California Berkeley Extension, Hewlett-Packard, Agilent, Freescale Semiconductor, and General Motors University. Previously Lee was Principal EMC and Systems Engineer at Digital Equipment Corporation’s Workstation Systems Engineering Group in Palo Alto, California. With over 25 years of EMC design and troubleshooting experience, Lee consults and teaches worldwide, and has been teaching short courses on EMC design and troubleshooting for twenty years, He has presented EMC courses in Taiwan, Singapore, Mexico, Norway, Canada, South Korea, Germany, France, and United Kingdom.
Lee frequently volunteers for the IEEE EMC Society and currently chairs the annual IEEE EMC Symposium’s Fundamentals program & is an instructor for the Symposium’s Global University Program. He is also a past member of the IEEE EMC Society's Board of Directors (2004-2007), and has also served as a member of the Society’s Awards Committee. In 1994, Lee was appointed to serve a two year term as an IEEE EMC Society Distinguished Lecturer (DL), and from 1999-2006 he served as chair of the DL program. Over the past twenty years Lee has been a frequent featured speaker at IEEE EMC Society fundraising events in cities throughout the US including Santa Clara, Seattle, Portland, Chicago, Milwaukee, Dallas/Fort Worth and Detroit. He has also provided technical presentations to Society chapters in Los Angeles, San Diego, Boston, Austin, Atlanta, Colorado Springs, Pittsburgh, and Orange County, CA.
After attending this course you will be able to:
- Effortlessly identify unintentional antennas using pictures of past SILENT projects with EMI problems
- Easily and simply visualize common-mode current in cables and enclosures
- Explain the four noise coupling paths, & identify near-field coupling in real designs
- Understand the function of grounds electronic product design
- Understand shielding of enclosures and cables, without electromagnetics mathe-matics
- Design a "good enough" high frequency shield
- Design a "good enough" low frequency shield
- Identify the most common types of grounding and shielding defects
- Apply the concepts of conductivity, transfer impedance, and skin depth to practi-cal designs
- Estimate the resonant frequencies of enclosures, slots, and waveguides
- Specify shielded connectors and cable assembly to ensure good system EMC
If you would like to discuss your application or any part of the application process before applying, please click Contact Us at the top of this page.
Level and demands
This course is intended for mechanical and electrical engineers responsible for the mechanical design and packaging of electronic products, cables, and systems. But it is also appropriate for Digital Logic Designers, Analogue Designers, Technicians, EMC Specialists, and Applications Engineers. Anyone working with electronic circuits along with conductive enclosures, shielded and unshielded cables who is concerned the control of low and high frequency electrical noise in electronic systems in order to meet functional and regulatory EMI / EMC specifications will enjoy this course.
Terms and conditions
Terms and conditions for applicants and students on this course
Sources of funding
Information on financial support